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| SV05..F SV05..F Fast Recovery Diode Advance Information Replaces March 1998 version, DS4144-3.4 DS4144-4.0 January 2000 APPLICATIONS s Induction Heating s A.C. Motor Drives s Snubber Diode s Welding s High Frequency Rectification s UPS KEY PARAMETERS VRRM 2500V IF(AV) 145A IFSM 2500A Qr 150C trr 2.2s FEATURES s Double Side Cooling s High Surge Capability s Low Recovery Charge VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage VRRM V 2500 2400 2200 2000 Conditions SV05 25F M or K SV05 24F M or K SV05 22F M or K SV05 20F M or K VRSM = VRRM + 100V For 1/2" 20 UNF thread, add suffix K, e.g. SV05 25FK. For M12 thread, add suffix M, e.g. SV05 25FM. For stud anode add 'R' to type number, e.g. SV05 25FMR. For outline DO8C add suffix 'C' to typ number, e.g. SV05 25FKC. Outline type codes: DO8 and DO8C. See Package Details for further information. CURRENT RATINGS Symbol IF(AV) IF(RMS) IF Parameter Mean forward current RMS value Continuous (direct) forward current Conditions Half wave resistive load, Tcase = 65oC Tcase = 65oC Tcase = 65oC Max. 145 225 195 Units A A A 1/8 SV05..F SURGE RATINGS Symbol IFSM I2t IFSM I2t Parameter Surge (non-repetitive) forward current 10ms half sine; with 0% VRRM, Tj = 150oC I2t for fusing Surge (non-repetitive) forward current 10ms half sine; with 50% VRRM, Tj = 150oC I2t for fusing 20 x 103 A2s 31 x 103 2.0 A2s kA Conditions Max. 2.5 Units kA THERMAL AND MECHANICAL DATA Symbol Rth(j-c) Rth(c-h) Tvj Tstg Parameter Thermal resistance - junction to case Thermal resistance - case to heatsink Virtual junction temperature Storage temperature range Mounting torque dc Mounting torque 15Nm with mounting compound On-state (conducting) Conditions Min. -55 13.5 Max. 0.23 0.02 150 150 16.5 Units o C/W o C/W o C C o Nm CHARACTERISTICS Symbol VFM IRRM trr QRA1 IRM K VTO rT VFRM Forward voltage Peak reverse current Reverse recovery time Recovered charge (50% chord) Reverse recovery current Soft factor Threshold voltage Slope resistance Forward recovery voltage At Tvj = 150oC At Tvj = 150oC di/dt = 1000A/s, Tj = 125oC IF = 600A, diRR/dt = 80A/s Tcase = 150oC, VR = 100V Parameter Conditions At 600A peak, Tcase = 25oC At VRRM, Tcase = 150oC Typ. 2.2 Max. 2.8 50 150 140 1.4 2.5 250 Units V mA s C A V m V 2/8 SV05..F DEFINITION OF K FACTOR AND QRA1 QRA1 = 0.5x IRR(t1 + t2) dIR/dt 0.5x IRR IRR t1 t2 k = t1/t2 CURVES 1000 Measured under pulse conditions 900 Instantaneous forward current IF - (A) 800 700 Tj = 150C Tj = 25C 600 500 2.0 2.5 3.0 3.5 4.0 4.5 Instantaneous forward voltage VF - (V) Fig.1 Maximum (limit) forward characteristics 3/8 SV05..F 500 Measured under pulse conditions 400 Instantaneous forward current IF - (A) Tj = 25C 300 Tj = 150C 200 100 0 1.0 1.5 2.0 2.5 3.0 Instantaneous forward voltage VF - (V) Fig.2 Maximum (limit) forward characteristics 4/8 SV05..F 10000 IF QS = 50s 0 Conditions: Tj = 150 C, QS VR = 100V Reverse recovered charge QS - (C) 1000 tp = 1ms dIR/dt IRR IF = 1000A IF = 500A IF = 200A IF = 100A 100 10 1 10 100 Rate of rise of reverse current dIR/dt - (A/s) Fig.3 Recovered charge 1000 1000 Conditions: Reverse recovery current IRR - (A) Tj = 150C, VR = 100V IF = 1000A 100 10 1 10 100 Rate of rise of reverse current dIR/dt - (A/s) 1000 Fig.4 Typical reverse recovery current vs rate of rise of reverse current 5/8 SV05..F 0.1 Thermal impedance - (C/W) d.c. 0.01 0.001 0.01 0.1 1 Time - (s) 10 100 Fig.5 Maximum (limit) transient thermal impedance - junction to case - (C/W) 6/8 SV05..F PACKAGE DETAILS - DO8 and DO8C For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. O8.4 0.3 8 min 20 max 163 10 O5.2 0.2 12 0.5 12 0.5 Type No + K - 20.6 0.6 Type No + M - 18.0 0.5 8 min 3.17 max Thread M12 1/2" 20 UNF 8 min 3.17 max Thread M12 1/2" 20 UNF Nominal weight: 120g Mounting torque: 15Nm 10% Package outine type code: DO8 Nominal weight: 120g Mounting torque: 15Nm 10% Package outine type code: DO8C Type No + K - 20.6 0.6 Type No + M - 18.0 0.5 O27 max 60 max O27 max 7/8 SV05..F POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). HEATSINKS Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS4144-4 Issue No. 4.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 8/8 |
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